项目Item 技术指标Technical parameter 最大加工面积MAX.Board Size 单面/双面板Single/Double Sided P.C.B 800*550 板厚Board Thickness 0.5mm-3.mm 最小线宽The Min.Track 0.1mm 最小间隙The Min Space 0.1mm 最小孔径Min Hole Size 0.3mm 孔壁厚度Hile Plating Tolerance PTH Thickness >0.025mm 金属化孔孔径公差PTH .Tolerance ±0.075mm 非金属化孔孔径公差NPTH Tolerance ±0.05mm 孔位公差 Hole Position Tolerance ±0.05mm 外形尺寸公差Outine Demesion Tolerance ±0.15mm 绝缘电阻 Insulation Resistance 孔电阻Through Hole Resistance <300U 抗电强度Dielectric Strength >1.6kv/mm 耐电流Current Breakdown 10A 抗剥强度Peel-off Strength 1.5n/mm 阻焊剂硬度Solder Mask Abrasion >5H 热冲击Thermal Stress 自熄性Inflammability 94vo 通断测试电压E-Test Voltage 10-250V 焊盘拉脱强度Pull of Stength of Peels 100N 可焊性Soder Ability 翘曲度Bow and Twist <0.01mm/mm